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1

Electrodeposition of lead‐free solder alloys

Goh, Yingxin, Haseeb, A.S.M.A., Faizul Mohd Sabri, Mohd

Journal:

Soldering & Surface Mount Technology

Year:

2013

Language:

english

File:

PDF, 533 KB

english, 2013

2

Hydraulic and strength characteristics of pervious concrete containing a high volume of construction and demolition waste as aggregates

Ibrahim, Hussein Adebayo, Goh, Yingxin, Ng, Zheng Ann, Yap, Soon Poh, Mo, Kim Hung, Yuen, Choon Wah, Abutaha, Fuad

Journal:

Construction and Building Materials

Year:

2020

File:

PDF, 4.62 MB

2020

3

Formation of Sn–Bi solder alloys by sequential electrodeposition and reflow

Yingxin Goh, Seen Fang Lee…

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2013

Language:

english

File:

PDF, 493 KB

english, 2013

4

Formation and characterization of intermetallic compounds in electroplated cobalt–tin multilayers

Goh, Yingxin, Goh, Yi Sing, Lee, Ee Lynn, Ong, Meng Teck, Haseeb, A. S. M. A.

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2018

Language:

english

File:

PDF, 1.47 MB

english, 2018

5

Characterization of pervious concrete with blended natural aggregate and recycled concrete aggregates

Yap, Soon Poh, Chiat Chen, Paul Zhao, Goh, Yingxin, Ibrahim, Hussein Adebayo, Mo, Kim Hung, Yuen, Choon Wah

Journal:

Journal of Cleaner Production

Year:

2018

Language:

english

File:

PDF, 3.34 MB

english, 2018

6

Reference Module in Materials Science and Materials Engineering || Bamboo: The Emerging Renewable Material for Sustainable Construction

Year:

2019

Language:

english

File:

PDF, 1.10 MB

english, 2019

7

Relationship between microstructure and performance of polypropylene fibre reinforced cement composites subjected to elevated temperature

Yap, Soon Poh, Goh, Yingxin, Goh, Wan Xien, Mo, Kim Hung, Liu, Michael Yong Jing, Ibrahim, Hussein Adebayo

Journal:

European Journal of Environmental and Civil engineering

Year:

2020

File:

PDF, 3.11 MB

2020

8

Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder

Goh, Yingxin, Haseeb, A.S.M.A., Sabri, Mohd Faizul Mohd

Journal:

Electrochimica Acta

Year:

2013

Language:

english

File:

PDF, 1.85 MB

english, 2013

9

[IEEE 2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012) - Penang, Malaysia (2012.07.10-2012.07.11)] 2012 4th Asia Symposium on Quality Electronic Design (ASQED) - Formation of Sn-Bi alloys through sequential electrodeposition

Lee Seen Fang,, Haseeb, A.S.M.A., Goh Yingxin,

Year:

2012

Language:

english

File:

PDF, 604 KB

english, 2012

10

[IEEE 2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012) - Penang, Malaysia (2012.07.10-2012.07.11)] 2012 4th Asia Symposium on Quality Electronic Design (ASQED) - Effects of Mn nanoparticles on wettability and intermetallic compounds in between Sn-3.8Ag-0.7Cu and Cu substrate during multiple reflow

Koh Kai Xiang,, Haseeb, A.S.M.A., Arafat, M.M., Goh Yingxin,

Year:

2012

Language:

english

File:

PDF, 1.07 MB

english, 2012

11

[IEEE 2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012) - Penang, Malaysia (2012.07.10-2012.07.11)] 2012 4th Asia Symposium on Quality Electronic Design (ASQED) - Effects of Sn concentration and current density on Sn-Bi electrodeposition in additive free plating bath

Chiew Ying Heong,, Haseeb, A.S.M.A., Goh Yingxin,, Lee Seen Fang,

Year:

2012

Language:

english

File:

PDF, 1.06 MB

english, 2012

12

[IEEE 2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012) - Penang, Malaysia (2012.07.10-2012.07.11)] 2012 4th Asia Symposium on Quality Electronic Design (ASQED) - Effects of hydroquinone and gelatin on the electrodeposition of SnBi low temperature Pb-free solder

Goh Yingxin,, Haseeb, A.S.M.A., Mohd Faizul Mohd Sabri,

Year:

2012

Language:

english

File:

PDF, 990 KB

english, 2012

13

[IEEE 2012 4th Asia Symposium on Quality Electronic Design (ASQED 2012) - Penang, Malaysia (2012.07.10-2012.07.11)] 2012 4th Asia Symposium on Quality Electronic Design (ASQED) - Effects of thiourea and gelatin on the electrodeposition of Sn-Ag solder alloy

Lee Xin Wei,, Haseeb, A.S.M.A., Goh Yingxin,

Year:

2012

Language:

english

File:

PDF, 1.05 MB

english, 2012

14

[IEEE 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Ipoh, Perak, Malaysia (2012.11.6-2012.11.8)] 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) - Effects of stacking sequence of electrodeposited Sn and Bi layers on reflowed Sn-Bi solder alloys

Seen Fang Lee,, Yingxin Goh,, Haseeb, A.S.M.A.

Year:

2012

Language:

english

File:

PDF, 1.10 MB

english, 2012

15

Deformation and fracture behaviour of electroplated Sn–Bi/Cu solder joints

Goh, Yingxin, Haseeb, A. S. M. A., Liew, Haw Ling, Sabri, Mohd Faizul Mohd

Journal:

Journal of Materials Science

Year:

2015

Language:

english

File:

PDF, 3.43 MB

english, 2015

16

Studies on electrodeposition behavior of Sn–Bi alloys in plating baths modified by hydroquinone and gelatin

Goh, Yingxin, Haseeb, A. S. M. A.

Journal:

Journal of Materials Science

Year:

2016

Language:

english

File:

PDF, 1.43 MB

english, 2016

17

Reference Module in Materials Science and Materials Engineering || Bamboo: The Emerging Renewable Material for Sustainable Construction

Year:

2019

File:

PDF, 1.10 MB

2019

18

Growth and mechanical properties of intermetallic compound between solid cobalt and molten tin

Lee, Ee Lynn, Goh, Yingxin, Haseeb, A. S. M. A.

Journal:

Journal of Materials Science: Materials in Electronics

Year:

2020

File:

PDF, 1.93 MB

2020

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